• Mechanical Design Engineer Jobs in Malaysia - 993909



    PacTech Asia Sdn Bhd
  • 2 - 4 Years
  • Malaysia - Penang - Bayan Lepas - Plot 14,Medan Bayan Lepas,Technoplex,Phase 4
Login to Apply Register and Apply
  • Save Job
  • Posted above 1 month
  • Job Views: 14
  • Job Applicants: Less than 10

Job Description

Job Responsibilities
Design and development of advanced laser bumping and bonding products from prototype to finished product for release to manufacturingTo design, build and lead automation and equipment projectsAbility to work and guide with other design engineers to reach solutionsAbility to trouble shoot and rectify problems encountered in the design environmentCommunicate with suppliers to meet design specification and qualityInteract with Marketing to develop specifications for new product developmentTo design and fabricate prototypes and evaluate the performance of the prototypeInteract with customers in new product trialsInteract on multi-functional product development teamsProactive in identifying design and technical challenges early in desgin stageCreate new, innovative and creative ideas to solve technical challenge

Job Requirements
Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalentAt least 2-5 Year(s) of working experience in the related field is required for this positionAble to use AutoCAD (2D software), SolidWorks (3D Software) and other relevant programAble to understand and draw engineering drawing such as geometric tolerances and dimensioningStrong interest in machine design and automationIndependent, team player, result-oriented and able to work under tight scheduleHands-on in assembly, problem analysis and solvingExcellent interpersonal and communication skillsMust be flexible and willing to travel either domestic or overseas when required

Profile Summary

Type:Company Job

Role:Junior Executive

Industry:Manufacturing/Production

Salary:Not Disclosed

Deadline:02nd Feb 2020

Company Profile

PacTech is a worldwide leader in wafer level packaging technologies and advanced packaging equipment manufacturing with volume production facilities across 3 continents at Germany, USA, and Malaysia. With over 20 years of experience in the industry, we have received over 100 patents and built over 1000 production machines. In line with our further expansion plan in Malaysia for high volume manufacturing in wafer level packaging services, we are seeking individuals with strong background in chemical engineering, material science, backend processing and wafer level packaging for our PacTech Asia operations.

New Job Seeker

Register With Us
or

Upload CV

Max 2 MB, doc, docx, rtf, pdf
We will fill your details