Job Summary
  • Experience 2-4 Years
  • Telecommuting

Job Description

Job ResponsibilitiesDesign and development of advanced laser bumping and bonding products from prototype to finished product for release to manufacturing.To design, build and lead automation and equipment projects.Ability to work and guide with other design engineers to reach solutions.Ability to trouble shoot and rectify problems encountered in the design environment.Communicate with suppliers to meet design specification and quality.Interact with Marketing to develop specifications for new product development.To design and fabricate prototypes and evaluate the performance of the prototype.Interact with customers in new product trials.Interact on multi-functional product development teams.Proactive in identifying design and technical challenges early in desgin stage.Create new, innovative and creative ideas to solve technical challengeJob RequirementsCandidate must possess at least Bachelor s Degree/Post Graduate Diploma/Professional Degree in Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent.At least 2-5 Year(s) of working experience in the related field is required for this position.Able to use AutoCAD (2D software), SolidWorks (3D Software) and other relevant program.Able to understand and draw engineering drawing such as geometric tolerances and dimensioning.Strong interest in machine design and automation.Independent, team player, result-oriented and able to work under tight schedule.Hands-on in assembly, problem analysis and solving.Excellent interpersonal and communication skills.Must be flexible and willing to travel either domestic or overseas when required.

Profile Summary

Type : Company job

Role : Junior Executive

Industry : Manufacturing/Production

Salary : Not Disclosed

Deadline: 2020-02-02

Company Profile

PacTech is a worldwide leader in wafer level packaging technologies and advanced packaging equipment manufacturing with volume production facilities across 3 continents at Germany, USA, and Malaysia. With over 20 years of experience in the industry, we have received over 100 patents and built over 1000 production machines. In line with our further expansion plan in Malaysia for high volume manufacturing in wafer level packaging services, we are seeking individuals with strong background in chemical engineering, material science, backend processing and wafer level packaging for our PacTech Asia operations.
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