Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others Xilinxs core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moores Law, and the dawn of artificial intelligence (AI)
Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything Come do your best work and live your best life as part of the ONEXILINX team!
We are looking for a talented, self-driven and motivated mechanical engineer to be part of a technology development team in Xilinx This team develops cutting-edge technologies used in our products and its team members have ample opportunities to grow their technical knowledge and complex problem-solving skills
In this position, this engineer will work in the thermo-mechanical product development and the introduction of the solution to the production The candidate will need to have strong experience in understanding of the mechanical design and heat transfer of electronics equipment and packaging
We Are Looking For Someone Who Demonstrates
Strong communication, teamwork, and problem solvingExcellent verbal and written communication skillsA proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completionIntense collaborationThoughtful, fast, disciplined executionTenacious commitment to continuous improvementRelentless drive to win
Experience And Skills
CAD Very strong experience with Creo Is required and it will be plus to have SolidWorksFEA very strong FEA experience is required using ANSYSIndustrial experience very strong experience of development mechanical design solutions for PCI-e card, mother boards for serverManufacturing Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North AmericaLab Skills Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis
This is to cover
Mechanical pressure measurement,Mechanical warpage using Shadow Morrie’, DIC,FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAMAir flow measurement and thermal measurementExperience in the Reliability assessment of thermal and mechanical design, as, Silicon and packaging CFD Experience with Icepak and/or Flotherm is a plusEducation RequirementsBachelor’s degree with five- seven years relevant experience (or Masters with three – four years or PhD with one plus year) in Mechanical Engineering in an electronics-cooling related Thermal/Mechanical Engineering role
To apply for this position please go to
Salary:SGD 5,500 - 7,500
Deadline:07th Mar 2020
Xilinx (NASDAQ: XLNX) is the world’s leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs, enabling the next generation of smarter, connected, and differentiated systems and networks.
With over 3,500 patents and 60 industry firsts, Xilinx is known for its historic achievements including the introduction of the first FPGA and the inception of the fabless model. Recent innovations have transformed Xilinx from its programmable logic heritage to an ‘All Programmable’ company, including Vivado HLS C based synthesis, three SDx software defined development environments, new Zynq heterogeneous multi-processing SoCs (MPSoCs) and new UltraScale ASIC-class FPGAs and 3D ICs.
Smarter Systems require more decision-making intelligence. Our customers use our products to bring Smarter Systems to life. Everything from automotive infotainment and driver safety systems, ultrasound imaging, robotically-assisted surgical systems, advanced wired networks, LTE wireless base stations, 3D TVs, next-generation displays and cameras, factory automation, low-power data centers, surveillance systems, and even sophisticated space vehicles like the Mars Rover for exploring the outer reaches of the universe.
Xilinx takes pride in supporting its community; both externally and internally. Xilinx has a history of developing programs for its employees and surrounding communities that provide a social impact through outreach, volunteerism, teambuilding and philanthropy. Areas of focus include education, health, arts and social services. Xilinx culture is represented by a pride in leadership, a passion for excellence, and personal growth.
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