In your new role you will:Observes and proactively acts on trends in Package Innovation. Has a sense of urgency for upcoming innovation and supports feasibility studies.Facilitates and encourages innovation within his/her field of expertise. Coaches & challenges new ideas actively balances risks and opportunities and drives decisionsContributes to Functional Area business value, roadmap/standards definition with industry partners and development and implementation of strategy within his/her field of expertiseContribute to the IP strategy in his/her field of expertise providing exploitation options. Fosters patent creation and IFX reputation through publications and speechesMake technical decisions for BL/Functional Area and takes responsibility for implementation. Be a mentor, shares knowledge and fosters talentsActively scout for new packaging technologies and keep in touch with package development at competitors/subcons.Drive innovation and pre development activity within package platform.You are best equipped for this task if you have:Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)At least 9 years of relevant working experience in IC/semiconductor environmentExperienced in Semiconductor Packaging, Assembly and TestProcess and Equipment Engineering knowledgeSemiconductor Products application knowledgeAnalytical and Problem Solving SkillsAutoCAD and 3D drafting knowledgeMaterial science knowledgePackage requirement and qualification knowledge
Type : Company job
Role : Senior Executive
Industry : Semiconductor/Wafer Fabrication
Salary : Not Disclosed
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2016 fiscal year (ending 30 September), the Company reported sales of about €6.5 billion with some 36,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
Since its inception in 1973, Infineon Technologies (Malaysia) Sdn Bhd has continuously expanded its operations and enlarged its manufacturing facilities to become the largest backend manufacturing site for Infineon and the largest employer in the Melaka state. The company’s investment in state-of-the art technologies and in employee trainings continues to drive performance excellence in meeting customers’ demands in today’s competitive business environment.
Further information is available at www.infineon.com